Bosch's 6-Axis IMU in the Apple iPhone X Complete Teardown Report 2018 - ResearchAndMarkets.com

DUBLIN--()--The "Bosch's 6-Axis IMU in the Apple iPhone X Complete Teardown Report" report has been added to ResearchAndMarkets.com's offering.

This report includes a detailed physical analysis, with process description and manufacturing cost analysis. A complete comparison with Bosch Sensortec's BMI160 is also provided, along with a comparison with InvenSense and STMicroelectronics' latest 6-axis IMUs.

With the introduction of Apple's latest products in Q4 2017, Bosch Sensortec is now the undisputed leader in MEMS IMU for consumer applications. Indeed, Bosch completely crushed the competition by replacing InvenSense inside the newest iPhone 8 and iPhone X, and supplanting STMicroelectronics for the Apple Watch Series 3. These three new design wins give Bosch hundreds of millions of unit sales per year.

This new Bosch Sensortec component is likely a custom 6-axis IMU made specifically for Apple. It is exactly the same component found inside the iPhone 8, iPhone X, and Apple Watch Series 3. One major improvement is the incredibly thin profile achieved by Bosch, with a total thickness of only 0.6mm compared to 0.9mm for the industry standard. This thickness was probably an Apple request in order to fit with the small form factor of the Apple Watch Series 3's cellular functionality. To achieve this low profile, Bosch changed the packaging structure used for its preceding product, the BMI160.

On the design side, Bosch Sensortec made significant changes - particularly for the accelerometer, where the old single-mass structure was abandoned for a new structure achieving better sensing properties. The micromachining manufacturing process, unchanged by Bosch Sensortec for many years, was also revised, with a new process for both accelerometer and gyroscope.

Finally, a new ASIC die was designed to fuse the data from the accelerometer and gyroscope, and probably to deliver even lower current consumption and other functionalities.

Key Topics Covered:

1. Overview /Introduction

Executive Summary

Reverse Costing Methodology

2. Company Profile

Bosch Sensortec

Consumer IMU Market

Apple iPhone X, iPhone 8, and Watch Series 3 Teardown

3. Physical Analysis

Synthesis of the Physical Analysis

Package

View and dimensions

Opening

Wire bonding process

Cross-section

Physical Comparison

Bosch IMU sensor evolution

Comparison with IMUs from InvenSense and STMicroelectronics

4. Sensor Manufacturing Process

ASIC Die Front-End Process and Fabrication Unit

MEMS Accelerometer Process and Fabrication Unit

MEMS Gyroscope Process and Fabrication Unit

Packaging and Final Test Fabrication Units

5. Cost Analysis

Synthesis of the Cost Analysis

Yields Explanation and Hypotheses

ASIC Component

Wafer front-end cost, probe test, thinning and dicing

ASIC wafer and die cost

MEMS Accelerometer Die

MEMS Gyroscope Die

LGA Packaged Component

Companies Mentioned

  • Apple
  • Bosch
  • InvenSense
  • STMicroelectronics

For more information about this report visit https://www.researchandmarkets.com/research/cp4c2m/boschs_6axis?w=4

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Manager
press@researchandmarkets.com
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Related Topics: Smartphones and Mobile Devices

Contacts

ResearchAndMarkets.com
Laura Wood, Senior Manager
press@researchandmarkets.com
For E.S.T Office Hours Call 1-917-300-0470
For U.S./CAN Toll Free Call 1-800-526-8630
For GMT Office Hours Call +353-1-416-8900
Related Topics: Smartphones and Mobile Devices